Micron and Intel today announced the first samples of their 3D NAND flash memory chips have been sent to manufacturers. Mass production of the stacked flash chips should start later this year. The new 3D NAND flash memory chips should make 10TB capacity SSDs possible.
Intel announced last year that it's working together with Micron on 3D NAND chips where memory cells are not only next to each other but also stacked. In Intel and Micron's design 32 layers with a capacity of 256 Gigabit, or 32GB for MLC NAND, are stacked. When TLC technology is used for the chips, the capacity increased to 48GB or 384 Gigabit.
According to Micron and Intel their new 3D flash memory chips will make it possible to fit 10GB or more in a regular sized SSD. The technology should also make it possible to create 3TB USB sticks. Besides the larger capacities the 3D NAND chips are cheaper to manufacturer which should also result in cheaper products for end users. Another advantage is that inactive NAND can be switched off, resulting in lower power consumption.
The 256Gb MLC version of 3D NAND is sampling with select partners today, and the 384Gb TLC design will be sampling later this spring. The fab production line has already begun initial runs, and both devices will be in full production by the fourth quarter of this year. Both companies are also developing individual lines of SSD solutions based on 3D NAND technology and expect those products to be available within the next year.
Yesterday also Toshiba and Sandisk announced 3D NAND, Samsung already ships 3D NAND based SSDs.
